@article{zhan,
  title = {Thermal Conductivity and Thermal Boundary Resistance of Low–Dielectric Constant Interlayer Dielectrics in Advanced Very Large Scale Integration Interconnects},
  author = {Tianzhuo Zhan, Chong Zheng, Mao Xu, Zhi Cao, Yen-Ju Wu, Yibin Xu, Ryo Yokogawa, Atsushi Ogura, Yanming Xue, Haidong Wang, Mengjie Song, Wei Wang, Bo Chen, Takanobu Watanabe, Yonggang Jiang, Huawei Chen, Deyuan Zhang},
  publisher = {American Chemical Society (ACS)},
  year = {2025},
  keywords = {thermal conductivity, thermal boundary resistance, low-k dielectrics, VLSI interconnects, persistent homology}
}