# Thermal stability investigation for Ohmic contact properties of Pt, Au, and Pd electrodes on the same hydrogen-terminated diamond

https://mdr.nims.go.jp/datasets/6f193aa8-8069-4265-a9cb-59b0259da1db

## File

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## Id

6f193aa8-8069-4265-a9cb-59b0259da1db

## Local identifier



## Visibility

open_to_public

## State

published

## Created at

2023-02-24T11:55:16.682739Z

## Updated at

2024-01-05T13:12:23.924453Z

## Published at

2023-02-28T02:20:19.148322Z

## Doi



## First published url

https://doi.org/10.1063/5.0008167

## Date published

2020-05-01

## Recorded date published

2020-5-1

## Resource type

journal_article

## Manuscript type

vor

## Collection



## Title

- title: Thermal stability investigation for Ohmic contact properties of Pt, Au, and
    Pd electrodes on the same hydrogen-terminated diamond
  title_type: original
  lang: en

## Description

- description: 'Here, thermal stabilities for Ohmic contact properties of Pt, Au,
    and Pd on the same hydrogen-terminated diamond (H-diamond) epitaxial layer are
    investigated. A long-term annealing process is performed with annealing temperature
    and time of 400 °C and 8 hours, respectively. Before annealing, good Ohmic contact
    properties are observed for only two contacts of Pt/H-diamond and Pd/H-diamond
    with their specific contact resistivity (ρ_C) values of 2.7 × 10‒3 and 2.6 × 10‒4
    Ω cm2, respectively. After the long-term annealing, all of three contacts on the
    H-diamond show good Ohmic contacts properties. The ρ_C values for the Pt/H-diamond
    and Au/H-diamond are 3.1 × 10‒2 and 4.2 × 10‒4 Ω cm2, respectively. They are higher
    than that of the Pd/H-diamond (1.1 × 10‒4 Ω cm2). Therefore, the low ρ_C and good
    thermal stability for the Pd/H-diamond are achieved. This is meaningful to push
    forward the development of H-diamond-based electronic devices for high-temperature
    applications. '
  description_type: abstract
  lang: eng

## Creator

- name: Xiaolu Yuan
  role: author
- name: Jiangwei Liu
  role: author
  orcid: https://orcid.org/0000-0003-2580-7401
  organization: National Institute for Materials Science
  ror: https://ror.org/026v1ze26
- name: Siwu Shao
  role: author
- name: Jinlong Liu
  role: author
- name: Junjun Wei
  role: author
- name: Bo Da
  role: author
  orcid: https://orcid.org/0000-0002-0785-8662
  organization: National Institute for Materials Science
  ror: https://ror.org/026v1ze26
- name: Chengming Li
  role: author
- name: Yasuo Koide
  role: author
  orcid: https://orcid.org/0000-0001-8321-9822
  organization: National Institute for Materials Science
  ror: https://ror.org/026v1ze26

## Contact agent



## Publisher

organization: AIP Publishing

## Managing organization



## Keyword

- subject: thermal stabilities for Ohmic contact properties
  schema: not_defined

## Rights

- description: Creative Commons BY Attribution 4.0 International
  identifier: https://creativecommons.org/licenses/by/4.0/

## Other identifier(s)



## Data origin

- data_origin_type: other

## Embargo



## Journal

- title: AIP Advances
  issn: '21583226'
  volume: '10'
  issue: '5'
  article_number: '55114'

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## Specimen



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## Fileset

- id: 2c90361a-3986-444a-8efd-37eea8c65d3a
  filename: shrine20230224-1595-evb8he.pdf
  content_type: application/pdf
  size: 4618387
  md5: 81fb9f1a7de69b42e77a6c477ba2de99

## Thumbnail

fileset_id: 2c90361a-3986-444a-8efd-37eea8c65d3a
filename: shrine20230224-1595-evb8he.pdf