# Oxygen incorporation effects on the structural and thermoelectric properties of copper(I) iodide

https://mdr.nims.go.jp/datasets/69518d78-990a-4807-9754-41b5fbe7cd05

## File

- [Journal of Applied Physics--Oxygen incorporation effects on the structural and thermoelectric properties of copper(I) iodide.pdf](https://mdr.nims.go.jp/filesets/047328fb-73ae-4bd1-b994-2ccd0d3d5ba2/download) ([Detail](https://mdr.nims.go.jp/filesets/047328fb-73ae-4bd1-b994-2ccd0d3d5ba2.md))

## Id

69518d78-990a-4807-9754-41b5fbe7cd05

## Local identifier



## Visibility

open_to_public

## State

published

## Created at

2024-12-07T00:52:55.671375Z

## Updated at

2024-12-09T07:30:46.349047Z

## Published at

2024-12-09T07:30:46.411616Z

## Doi



## First published url

https://doi.org/10.1063/5.0235467

## Date published

2024-11-28

## Recorded date published

2024-11-28

## Resource type

journal_article

## Manuscript type

vor

## Collection



## Title

- title: Oxygen incorporation effects on the structural and thermoelectric properties
    of copper(I) iodide
  title_type: original
  lang: en

## Description

- description: Oxygen is a ubiquitous contaminant in thin films grown in high vacuum
    systems, and it plays an important role in the properties of the p-type conductivity
    of transparent copper(I) iodide (CuI). We study the ambi-ent properties of copper
    iodide deposited at various partial pressures of oxygen gas. Through a variety
    of experimental techniques we find that achieving a critical oxygen partial pressure
    of below 3 × 10−5 mbar is essential for growing stoichiometric and conductive
    CuI thin films. Notably, we relate the commonly reported copper excess to the
    presence of oxygen within the CuI films. We study how the presence of oxygen affects
    the optical and structural properties of CuI. Finally, we infer from transport
    measurements that oxygen is not a shallow acceptor within CuI, as depositing it
    anywhere below the critical oxygen partial pressure results in no measurable dependency
    on the Hall carrier concentration.
  description_type: abstract
  lang: und

## Creator

- name: Martin Markwitz
  role: author
- name: Niall Malone
  role: author
- name: Song Yi Back
  role: author
  orcid: https://orcid.org/0009-0000-8890-1484
  organization: National Institute for Materials Science
- name: Alexander Gobbi
  role: author
- name: Jake Hardy
  role: author
- name: Peter P. Murmu
  role: author
- name: Takao Mori
  role: author
  orcid: https://orcid.org/0000-0003-2682-1846
  organization: National Institute for Materials Science
- name: Ben J. Ruck
  role: author
- name: John V. Kennedy
  role: author

## Contact agent



## Publisher

organization: AIP Publishing

## Managing organization



## Keyword

- subject: thermoelectric
  schema: not_defined

## Rights

- identifier: https://creativecommons.org/licenses/by/4.0/

## Other identifier(s)



## Data origin

- data_origin_type: other

## Embargo



## Journal

- title: Journal of Applied Physics
  issn: '00218979'
  volume: '136'
  issue: '20'
  article_number: '205702'

## Conference



## Related item



## Funding

- identifier: MFP-GNS2301
  funder_name: Marsden Fund
- identifier: JPMJMI19A1
  funder_name: JST-Mirai Program

## Instrument



## Instrument operator



## Instrument managing organization



## Measurement method



## Specimen



## Chemical composition



## Structure for specimen



## Structural feature for specimen



## Specific property for specimen



## Process for specimen treatment



## Computational method



## Energy level/transition state



## Software



## Custom property



## Fileset

- id: '047328fb-73ae-4bd1-b994-2ccd0d3d5ba2'
  filename: Journal of Applied Physics--Oxygen incorporation effects on the structural
    and thermoelectric properties of copper(I) iodide.pdf
  content_type: application/pdf
  size: 2603856
  md5: b0c237ad27db0e33a4c84296121b83b9

## Thumbnail

fileset_id: '047328fb-73ae-4bd1-b994-2ccd0d3d5ba2'
filename: Journal of Applied Physics--Oxygen incorporation effects on the structural
  and thermoelectric properties of copper(I) iodide.pdf