# Thickness-Dependent Cross-Plane Thermal Conductivity Measurements of Exfoliated Hexagonal Boron Nitride

https://mdr.nims.go.jp/datasets/6795a7b5-7b63-4911-aac4-b5bc8ac6632f

## File

- [acsami.2c21306.pdf](https://mdr.nims.go.jp/filesets/4de972ea-780f-4b0c-83d7-fbeb81969427/download) ([Detail](https://mdr.nims.go.jp/filesets/4de972ea-780f-4b0c-83d7-fbeb81969427.md))

## Id

6795a7b5-7b63-4911-aac4-b5bc8ac6632f

## Local identifier



## Visibility

open_to_public

## State

published

## Created at

2025-02-13T07:08:02.176376Z

## Updated at

2025-02-14T03:30:55.490016Z

## Published at

2025-02-14T03:30:55.568270Z

## Doi



## First published url

https://doi.org/10.1021/acsami.2c21306

## Date published

2023-03-08

## Recorded date published

2023-3-8

## Resource type

journal_article

## Manuscript type

vor

## Collection



## Title

- title: Thickness-Dependent Cross-Plane Thermal Conductivity Measurements of Exfoliated
    Hexagonal Boron Nitride
  title_type: original
  lang: en

## Description

- description: Sub-micron-thick layers of hexagonal boron nitride (hBN) exhibit high
    in-plane thermal conductivity, useful optical properties, and serve as dielectric
    encapsulation layers with low electrostatic inhomogeneity for graphene devices.
    Despite the promising applications of hBN as a heat spreader, the thickness dependence
    of its cross-plane thermal conductivity is not known, and the cross-plane phonon
    mean free paths (MFPs) have not been measured. We measure the cross-plane thermal
    conductivity of hBN flakes exfoliated from bulk crystals. We find that sub-micron
    thick flakes exhibit thermal conductivities up to 8.1 ± 0.5 W m−1K−1 at 295 K,
    which exceeds previously reported bulk values by more than 60%. Surprisingly,
    the average phonon mean free path is found to be several hundred nanometers at
    room temperature, a factor of five larger than previous predictions. When planar
    twist interfaces are introduced into the crystal by mechanically stacking multiple
    thin flakes, the cross-plane thermal conductivity of the stack is found to be
    a factor of seven below that of individual flakes with similar total thickness,
    thus providing strong evidence that phonon scattering at twist boundaries limits
    the maximum phonon MFPs. These results have important implications for hBN integration
    in nanoelectronics and improve our understanding of thermal transport in two-dimensional
    materials.
  description_type: abstract
  lang: und

## Creator

- name: Gabriel R. Jaffe
  role: author
- name: Keenan J. Smith
  role: author
- name: Kenji Watanabe
  role: author
  orcid: https://orcid.org/0000-0003-3701-8119
  organization: National Institute for Materials Science
- name: Takashi Taniguchi
  role: author
  orcid: https://orcid.org/0000-0002-1467-3105
  organization: National Institute for Materials Science
- name: Max G. Lagally
  role: author
- name: Mark A. Eriksson
  role: author
- name: Victor W. Brar
  role: author

## Contact agent



## Publisher

organization: American Chemical Society (ACS)

## Managing organization



## Keyword

- subject: Hexagonal boron nitride
  schema: not_defined
- subject: thermal conductivity
  schema: not_defined
- subject: phonon mean free paths
  schema: not_defined

## Rights

- identifier: https://creativecommons.org/licenses/by-nc-nd/4.0/

## Other identifier(s)



## Data origin

- data_origin_type: other

## Embargo



## Journal

- title: ACS Applied Materials & Interfaces
  issn: '19448252'
  volume: '15'
  issue: '9'
  start_page: 12545
  end_page: 12550

## Conference



## Related item



## Funding

- identifier: DE-FG02-03ER46028
  funder_name: Basic Energy Sciences
- identifier: DE-SC0020313
  funder_name: Basic Energy Sciences
- identifier: 19H05790
  funder_name: Japan Society for the Promotion of Science
- identifier: 20H00354
  funder_name: Japan Society for the Promotion of Science
- identifier: 21H05233
  funder_name: Japan Society for the Promotion of Science

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## Measurement method



## Specimen



## Chemical composition



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## Fileset

- id: 4de972ea-780f-4b0c-83d7-fbeb81969427
  filename: acsami.2c21306.pdf
  content_type: application/pdf
  size: 4067195
  md5: 7eaaf04ecfbdcfb65980a0af62849338

## Thumbnail

fileset_id: 4de972ea-780f-4b0c-83d7-fbeb81969427
filename: acsami.2c21306.pdf