# In Situ-Formed Nano-Cu Pathways in Binders Endowing Pastes High Conductivity with Low Metal Content

https://mdr.nims.go.jp/datasets/3551b6e7-1766-45fe-8ff4-7ae41e186aeb

## File

- [manuscript.docx](https://mdr.nims.go.jp/filesets/c6a42ed8-0a31-4428-a5d5-acdbde9165bc/download) ([Detail](https://mdr.nims.go.jp/filesets/c6a42ed8-0a31-4428-a5d5-acdbde9165bc.md))

## Id

3551b6e7-1766-45fe-8ff4-7ae41e186aeb

## Local identifier



## Visibility

open_to_public

## State

published

## Created at

2025-07-10T09:16:16.019108Z

## Updated at

2025-07-11T07:30:31.061220Z

## Published at

2025-07-11T07:17:23.737695Z

## Doi

https://doi.org/10.48505/nims.5579

## First published url

https://doi.org/10.1021/acsaelm.5c00471

## Date published

2025-06-24

## Recorded date published

2025-6-24

## Resource type

journal_article

## Manuscript type

authors_original

## Collection



## Title

- title: In Situ-Formed Nano-Cu Pathways in Binders Endowing Pastes High Conductivity
    with Low Metal Content
  title_type: original
  lang: en

## Description

- description: Although adding binders could significantly improve the adhesion between
    metal pastes and polymer substrates, they also considerably decrease the conductivity
    of printed circuits, limiting their applications in printed electronics. This
    study innovatively adds a copper (Cu) precursor to the paste to solve this problem.
    Cu nanoparticles are formed on the surface of Cu flakes and within the binders
    due to their in situ decomposition characteristics. The decomposed Cu nanoparticles
    construct more conductive pathways that improve the conductivity of the printed
    circuits. Furthermore, this study employs an orthogonal test to investigate the
    relationship between the formulation of pastes and the performance of printed
    circuits, optimizing the proportion of the Cu precursor and binders based on these
    results. Compared to conventional pastes that consist solely of Cu fillers, binders,
    and solvents, the paste developed in this study exhibits high conductivity, which
    is approximately 2.6 times that of the pure Cu flake paste at low metal content
    around 40%. Thus, with more binders, the printed circuits not only met the 5B
    level according to ASTM D3359 standards but also showed excellent electrical properties
    after curing at 200 °C for 5 min, achieving a resistivity as low as 331 μΩ·cm.
    Additionally, the paste exhibited outstanding performance in the application of
    heaters and ultrabroadband (UWB) antennas, further confirming its considerable
    potential for commercial printed circuits.
  description_type: abstract
  lang: und

## Creator

- name: Wanli Li
  role: author
  orcid: https://orcid.org/0000-0003-0271-5782
- name: Pengcheng Rui
  role: author
- name: Songtang Li
  role: author
- name: Lingying Li
  role: author
  orcid: https://orcid.org/0000-0002-3503-7829
- name: Takeo Minari
  role: author
  orcid: https://orcid.org/0000-0001-7690-221X
- name: Wendong Yang
  role: author
  orcid: https://orcid.org/0000-0002-4972-3002
- name: Su Ding
  role: author
  orcid: https://orcid.org/0000-0002-3427-649X
- name: Ke Li
  role: author

## Contact agent



## Publisher

organization: American Chemical Society (ACS)

## Managing organization



## Keyword

- subject: printed electronics
  schema: not_defined

## Rights

- description: This document is the unedited Author’s version of a Submitted Work
    that was subsequently accepted for publication in ACS Applied Electronic Materials,
    copyright © 2025 American Chemical Society after peer review. To access the final
    edited and published work see https://doi.org/10.1021/acsaelm.5c00471.
  identifier: http://rightsstatements.org/vocab/InC/1.0/

## Other identifier(s)



## Data origin

- data_origin_type: other

## Embargo



## Journal

- title: ACS Applied Electronic Materials
  issn: '26376113'
  volume: '7'
  issue: '12'
  start_page: 5495
  end_page: 5504

## Conference



## Related item



## Funding

- identifier: 23K23324
  funder_name: 日本学術振興会
  description: 複雑系錯体化学に基づく多元素プリンテッドエレクトロニクスの創成

## Instrument



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## Instrument managing organization



## Measurement method



## Specimen



## Chemical composition



## Structure for specimen



## Structural feature for specimen



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## Computational method



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## Fileset

- id: c6a42ed8-0a31-4428-a5d5-acdbde9165bc
  filename: manuscript.docx
  content_type: application/vnd.openxmlformats-officedocument.wordprocessingml.document
  size: 6909141
  md5: b6c06ab4788736bc6fcb62dcb0ca7fc5

## Thumbnail

fileset_id: c6a42ed8-0a31-4428-a5d5-acdbde9165bc
filename: manuscript.docx