@misc{kongping2024a,
  title = {Enhancement of interfacial thermal conductance by introducing carbon vacancy at the Cu/diamond interface},
  author = {Kongping Wu, Leng Zhang, Fangzhen Li, Liwen Sang, Meiyong Liao, Kun Tang, Jiandong Ye, Shulin Gu},
  publisher = {Elsevier BV},
  year = {2024-03-05},
  keywords = {Diamond, thermal conductivity, Cu}
}