論文 Detection and location of microdefects during selective laser melting by wireless acoustic emission measurement

ITO, Kaita SAMURAI ORCID (Research and Services Division of Materials Data and Integrated System/Data-driven Structural Materials Group, National Institute for Materials ScienceROR) ; KUSANO, Masahiro SAMURAI ORCID (Research Center for Structural Materials/Bonding and Manufacturing Field/Integrated Smart Materials Group, National Institute for Materials ScienceROR) ; DEMURA, Masahiko SAMURAI ORCID (Research and Services Division of Materials Data and Integrated System, National Institute for Materials ScienceROR) ; WATANABE, Makoto SAMURAI ORCID (Research Center for Structural Materials/Bonding and Manufacturing Field, National Institute for Materials ScienceROR)

コレクション

引用
ITO, Kaita, KUSANO, Masahiro, DEMURA, Masahiko, WATANABE, Makoto. Detection and location of microdefects during selective laser melting by wireless acoustic emission measurement. Additive Manufacturing. 2021, 40 (), 101915-101915. https://doi.org/10.1016/j.addma.2021.101915
SAMURAI

説明:

(abstract)

Microdefects sometimes form in workpieces fabricated by selective laser melting (SLM). It is difficult to understand the mechanism of generation of microdefects because the occurrence time during processing cannot be easily identified by conventional monitoring methods. We have therefore developed a convenient method for real-time monitoring of microdefects generation during SLM by using proprietary battery-powered equipment capable of continuous recording and wireless transmission of acoustic emission (AE) waveforms. To clarify the detection capabilities of the proposed method and to evaluate the factors that cause microcrack generation, AE monitoring was conducted for single-layer modeling tests with single-track or multi-track. We could successfully detect AE signals during the tests. The times of occurrence and locations of AE events were identified, and the results were compared with observations of the specimen cross-sections by the X-ray computed tomography (CT). At first in single-track tests, burst type AE events were detected during processing and their origin was confirmed to be pores and microcracks in the specimen. Then in multi-track tests, defects slightly after laser irradiation and defects due to the turning back of the irradiation were detected. The effectiveness and potential of our novel AE monitoring technique for the SLM process have been demonstrated.

権利情報:

キーワード: Selective laser melting, Crack detection, Acoustic emission, Wireless monitoring, Real-time monitoring

刊行年月日: 2021-02-18

出版者: Elsevier

掲載誌:

  • Additive Manufacturing (ISSN: 22148604) vol. 40 p. 101915-101915

研究助成金:

  • JST (本研究は,内閣府総合科学技術・イノベーション会議の戦略的イノベーション創造プログラム(SIP)「統合型材料開発システムによるマテリアル革命」(管理法人:JST)によって実施されました。)

原稿種別: 出版者版 (Version of record)

MDR DOI:

公開URL: https://doi.org/10.1016/j.addma.2021.101915

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更新時刻: 2024-01-05 22:11:37 +0900

MDRでの公開時刻: 2023-04-24 15:08:17 +0900

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