# Multi-objective topology optimization of porous microstructure in die-bonding layer of a semiconductor

https://mdr.nims.go.jp/datasets/1b6fc677-b2d4-49de-801c-ff3b895a4b0b

## File

- [Multi-objective topology optimization of porous microstructure in die-bonding layer of a semiconductor.pdf](https://mdr.nims.go.jp/filesets/625f49a8-8b87-4021-b17b-1e385a4aa9a8/download) ([Detail](https://mdr.nims.go.jp/filesets/625f49a8-8b87-4021-b17b-1e385a4aa9a8.md))

## Id

1b6fc677-b2d4-49de-801c-ff3b895a4b0b

## Local identifier



## Visibility

open_to_public

## State

published

## Created at

2024-03-08T03:32:07.061430Z

## Updated at

2024-04-12T07:30:17.056770Z

## Published at

2024-04-12T07:30:17.520320Z

## Doi



## First published url

https://doi.org/10.1080/27660400.2024.2320691

## Date published

2024-12-31

## Recorded date published

2024-12-31

## Resource type

journal_article

## Manuscript type

vor

## Collection



## Title

- title: Multi-objective topology optimization of porous microstructure in die-bonding
    layer of a semiconductor
  title_type: original
  lang: en

## Description

- description: To enhance semiconductor efficiency, it is imperative to develop a
    die-bonding material possessing exceptional thermal conductivity and stress-shielding
    capabilities to safeguard semiconductor components from detrimental heat and destructive
    stress. In this study, we employed a multi-objective topology optimization approach
    to design a porous microstructure for the die-bonding layer of semiconductors,
    targeting high thermal conductivity and low shear modulus. The finite element
    analysis method for a representative volume element (RVE) facilitates computational
    evaluations of macroscopic mechanical and thermal properties arepsilong from a
    periodic microstructure. Our investigation commenced with the creation of an RVE
    generator for obtaining periodic microstructures featuring randomly distributed
    pores with controlled morphological features. A high-throughput evaluation of
    numerous generated microstructures explored the impact of volume fraction and
    pore connectivity on macroscopic shear modulus and thermal conductivity. Despite
    the high-throughput evaluation indicating that pore connectivity has minimal effect
    on properties, the multi-objective topology optimization, addressing the conflict
    between maximizing thermal conductivity and minimizing shear modulus, revealed
    that connected pores and dispersed distribution in the architected microstructure
    contribute to improved material performance. In this optimization process, we
    employed a weighted sum method to find optimal compromised microstructures. Anisotropic
    and orthotropic microstructures were designed, and the effects of volume constrains
    and weight factors on microscopic morphology were explored. Despite the high-throughput
    evaluation suggesting a limited impact of pore connectivity, the results from
    multi-objective topology optimization underscored the significance of connected
    pores and dispersed distribution in achieving superior material performance.
  description_type: abstract
  lang: en

## Creator

- name: Jiaxin Zhou
  role: author
  orcid: https://orcid.org/0000-0001-7681-1668
  organization: National Institute for Materials Science
- name: Ikumu Watanabe
  role: author
  orcid: https://orcid.org/0000-0002-7693-1675
  organization: National Institute for Materials Science
- name: Weikang Song
  role: author
- name: Keita Kambayashi
  role: author
- name: Ta-Te Chen
  role: author
  orcid: https://orcid.org/0000-0002-0553-4736

## Contact agent



## Publisher

organization: Informa UK Limited

## Managing organization



## Keyword

- subject: Multi-objective topology optimization
  schema: not_defined
- subject: microstructure design
  schema: not_defined
- subject: porous microstructure
  schema: not_defined
- subject: highthroughput evaluation
  schema: not_defined
- subject: finite element analysis
  schema: not_defined

## Rights

- identifier: https://creativecommons.org/licenses/by/4.0/

## Other identifier(s)



## Data origin

- data_origin_type: other

## Embargo



## Journal

- title: 'Science and Technology of Advanced Materials: Methods'
  issn: '27660400'
  volume: '4'
  issue: '1'
  article_number: '2320691'

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## Fileset

- id: 625f49a8-8b87-4021-b17b-1e385a4aa9a8
  filename: Multi-objective topology optimization of porous microstructure in die-bonding
    layer of a semiconductor.pdf
  content_type: application/pdf
  size: 11578716
  md5: dacbe273a964245af6414c1c58fe9351

## Thumbnail

fileset_id: 625f49a8-8b87-4021-b17b-1e385a4aa9a8
filename: Multi-objective topology optimization of porous microstructure in die-bonding
  layer of a semiconductor.pdf