# Strengthening epoxy adhesives at elevated temperatures based on dynamic disulfide bonds

https://mdr.nims.go.jp/datasets/12a17248-abb3-423b-a319-5822c46de926

## File

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## Id

12a17248-abb3-423b-a319-5822c46de926

## Local identifier



## Visibility

open_to_public

## State

published

## Created at

2021-11-24T08:59:51.680265Z

## Updated at

2022-10-02T16:26:15.620434Z

## Published at

2021-12-02T16:32:53.021092Z

## Doi



## First published url

https://doi.org/10.1039/d0ma00714e

## Date published

2020-11-21

## Recorded date published

2020-12-14

## Resource type

journal_article

## Manuscript type

authors_original

## Collection



## Title

- title: Strengthening epoxy adhesives at elevated temperatures based on dynamic disulfide
    bonds
  title_type: original
  lang: en

## Description

- description: Epoxy resins incorporating aromatic disulfide bonds demonstrated improved
    adhesive properties with increasing temperature below their glass transition points.
    This behaviour was explained in terms of the relatively low topology freezing
    transition temperature of these materials as compared with their glass transition
    temperatures.
  description_type: abstract
  lang: en

## Creator

- name: TSAI, Hsing-Ying
  role: author
- name: NAKAMURA, Yasuyuki
  role: author
  orcid: https://orcid.org/0000-0003-0078-6413
- name: FUJITA, Takehiro
  role: author
- name: NAITO, Masanobu
  role: author
  orcid: https://orcid.org/0000-0001-7198-819X

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## Keyword

- subject: adhesive
  schema: not_defined

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## Fileset

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  filename: Ey0yu5-d0ma00714e.pdf
  content_type: application/pdf
  size: 2755654
  md5: 10e051c15d5f0e78fd048dd939063995

## Thumbnail

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filename: Ey0yu5-d0ma00714e.pdf