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Strengthening epoxy adhesives at elevated temperatures based on dynamic disulfide bonds
MDR Open Deposited
Epoxy resins incorporating aromatic disulfide bonds demonstrated improved adhesive properties with increasing temperature below their glass transition points. This behaviour was explained in terms of the relatively low topology freezing transition temperature of these materials as compared with their glass transition temperatures.
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- 21/11/2020
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- 01/11/2022
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Ey0yu5-d0ma00714e.pdf | 17/11/2021 | 2.63 MB | MDR Open |
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